Advanced packaging EDA tool
The Next-Gen AI-Powered EDA Integration Platform
AI-powered workflow automation for advanced semiconductor packaging and thermal design.
- 600× Faster simulation
- 69.89% Yield improvement
- R² 0.983 Prediction accuracy
- 10+ EDA tools connected
Package teardown
Open the package, layer by layer
Microchannel Thermal CFD
Lift the lid and see where the die runs hot. InPack.AI runs advanced fluid-dynamics simulation for extreme heat management in HPC packages, and predicts the temperature field in milliseconds with AI inference.
AI-Powered Warpage Simulation
As temperature changes, substrate, interposer and dies bend because their expansion coefficients differ. InPack.AI replaces slow FEM with an ML engine that predicts warpage and stress in milliseconds, and tunes parameters with DQN for a 69.89% yield improvement.
AI-Driven Routing & 3D Integration
Pull the HBM stack apart to see through-silicon vias and micro-bumps. InPack.AI generates RDL and 3DIC paths automatically to accelerate complex packaging layouts.
Product demo
InPack AI Agent
The semiconductor industry uses 10+ specialized EDA tools, each requiring months to master. InPack.AI is our answer — a unified AI platform that orchestrates your entire design workflow, from substrate to system, in one interface.
AI-powered multi-physics analysis
Thermal flow, stress, warpage. One view.
From substrate to CoWoS package, InPack.AI unifies all three simulations on one platform.
Our features
Modular AI-Powered EDA
We design, develop, and implement InPack.AI: an EDA platform that helps IC design teams work smarter, not harder.
Warpage analysis flow
- Simulation Configuration: Define package structure, boundary conditions and solver targets once, then reuse them.
- Geometry & Material Property: Parameterize geometry and materials to spin up CoWoS / FOPLP design variants fast.
- Data Generation & Processing: Auto-generate and clean training datasets to give AI models a reliable foundation.
- AI Model & Performance: Replace slow FEM with an ML engine that predicts warpage and stress in milliseconds.
- DQN Reinforcement Learning: Keep optimizing parameters with deep reinforcement learning to converge on the best yield.
AI-Powered Multi-Physics Analysis
Go beyond single-point warpage prediction. InPack.AI integrates thermal flow design, stress analysis, and warpage analysis in one unified platform — covering the entire design flow from substrate to CoWoS packaging. Achieve 600x acceleration with our ML-driven engine and 69.89% yield improvement through DQN-based parameter optimization.
AI Co-Design Studio
NeuroShine AI doesn't just predict; it creates. Through a Deep Reinforcement Learning (DQN) framework, it accurately simulates multi-physics effects without a massive database, providing reliable scientific validation for your designs with an R² score of up to 0.983.
Core competencies
The Six Pillars of InPackAI Flow Suite
InPackAI Flow Suite: empowered by six technological pillars
- AI Prediction: Millisecond-level warpage & stress prediction, replacing time-consuming FEM simulations.
- AI-Driven Routing: Automated RDL and 3DIC path generation to accelerate complex packaging layouts.
- Workflow Orchestration: Modular "Lego-style" architecture to seamlessly connect fragmented EDA stages.
- EDA Tool Bridge: Seamless data conversion and integration across mainstream EDA tools.
- AI Co-pilot: Natural language task dispatching powered by an advanced Skill + Memory framework.
- Microchannel Thermal CFD: Advanced fluid dynamics simulation for extreme heat management in HPC designs.
Zero disruption
Seamless EDA Tool Integration
InPack.AI works with your existing EDA stack — not against it. Deploy in the cloud for instant access, or on-premise for maximum data security. Either way, your existing workflow stays intact while gaining AI superpowers.
Strengths
Why Engineering Teams Choose InPack.AI
Discover how InPack.AI enhances efficiency, reduces costs, and drives design simulation with smarter, faster processes.
- End Tool Fragmentation: Before: switch between 10+ tools and 10+ file formats. Now: one unified platform with seamless data flow.
- Multi-Physics Integration: Seamlessly integrates multi-physics analysis on one platform, eliminating tool fragmentation.
- 24/7 Availability: AI-powered systems operate around the clock, ensuring seamless support and execution without downtime.
- Cost Reduction: AI automates routing and parameter settings, reducing manual intervention and optimizing resource allocation.
- Data-Driven Insights: Leverage AI to analyze large datasets, identify trends, and make smarter, faster, and more accurate design decisions.
- Predictive Accuracy: The InPack.AI core engine performs instant, accurate predictions in warpage analysis, providing a reliable basis for your decisions.
About Us
Who We Are
NeuroShine was founded with a vision:to build Taiwan's answer to the fragmented EDA landscape.
- Chi-Hua Yu (游濟華): An Associate Professor at NCKU specializing in AI bionics and multi-physics simulation technologies.
- Shin-Ruei Lin (林欣瑞): A senior software development expert from TSMC, specializing in numerical simulation methods and industrial software design.
Events & news
NEUROSHINE NEWS
- Our company participated in the GenAI Stars competition hosted by the Ministry of Digital Affairs at Taipei World Trade Center Hall 1 and received the Gold Award.
- NEUROSHINE convenes its shareholders' meeting on June 30, 2026.
- On June 9, 2026 (Pacific Time), our company held the "AI-Native EDA Research & Technology Sharing" seminar in Silicon Valley, attended by North American semiconductor experts, venture capitalists and tech entrepreneurs, where experts praised the technology behind InPack.AI.
- World Journal reports on NeuroShine: the team has developed an electronic design automation (EDA) platform that combines AI with multi-physics simulation, integrating different simulation tools to analyze thermal, electrical and structural factors together and shorten chip design and advanced packaging simulation time. This year NeuroShine joined the TREE Program promoted by the Ministry of Economic Affairs and trained at UC Berkeley SkyDeck.
- Sparknify's #MeetFounders introduces NeuroShine, a Taiwanese deep-tech startup at Taiwan Venture Day: NeuroShine developed InPack.AI, an EDA tool that combines AI with advanced optimization to help semiconductor engineers simplify complex design flows, move past the limits of traditional repeated simulation, and complete IC designs faster and more efficiently.
- Our company exhibited InPack.AI, its AI-driven advanced packaging platform, at InnoVEX, using agentic AI, multi-physics integration and high-speed simulation to help companies improve design efficiency and lower development costs.
- Our company attended the opening ceremony of the AI Innovation Application Building in Tainan as a resident company certified by the National Science and Technology Council, and introduced our technology and development progress to the Premier of the Executive Yuan.
- Our company was invited to participate in AI EXPO at Taipei Expo Park, where we showcased innovative applications of AI tools in the semiconductor industry.
- Our company attended NCKU Industry-Academia Innovation Day as an NCKU spin-off representative company and received the Industry-Academia Startup Golden Phoenix Award.
- NeuroShine received the GenAI Stars 2025 Gold Quality Award for "InPack.AI: a next-generation EDA tool driven by generative AI", in the application field of GenAI in the semiconductor industry. InPack.AI is an AI-driven automated design tool with inverse design, supporting heterogeneous-material package design, physics-field verification and high-speed processing.
- Our company participated in GCamp, the Global Entrepreneurship Training Program organized by the Small and Medium Enterprise and Startup Administration, Ministry of Economic Affairs, presenting our development and capabilities to Japanese and international venture capital investors.
- Our company was invited to the Asia Bay Startup Southern Taiwan Exhibition at the Kaohsiung Exhibition Center, where we showcased the outcomes of our collaborative project with ITRI.
FAQ
Frequently Asked Questions
How does InPack.AI EDA handle multi-physics simulation?
InPack.AI integrates thermal flow design, stress analysis and warpage analysis on one platform, replaces slow FEM solving with an ML engine, and keeps optimizing parameters with DQN reinforcement learning — giving consistent multi-physics analysis from substrate to CoWoS package.
Is our design data secure?
You can deploy on-premise so design data never leaves your environment, for maximum data security. Cloud deployment is available when you want instant access.
Can InPack.AI integrate with our existing EDA workflow?
Yes. InPack.AI works with mainstream EDA tools, acting as an orchestration layer over your existing flow — no need to replace your toolchain.
Besides warpage, what other specific problems can your tool solve?
Beyond warpage and stress prediction, InPack.AI covers automated RDL and 3DIC routing, microchannel thermal CFD analysis, parameter optimization and AI-generated reports.
What kind of support can we expect when using InPack.AI?
We provide onboarding, workflow setup and technical support. Email service_ns@neuroshine.co to discuss your needs and we will be in touch.
Contact
Get in Touch with Us
Have questions or need EDA AI solutions? Let us know, and we'll be in touch!
NeuroShine Technology Co., Ltd.
Room A218, 2F, No. 5, Guiren 15th Road, Guiren District, Tainan City 711010
AI Innovation Application Building, National Science and Technology Council