世界新聞網報導煊程科技：團隊開發結合 AI 與多物理模擬的電子設計自動化（EDA）平台，可整合不同模擬工具，同步分析散熱、電性及結構等因素，縮短晶片設計與先進封裝模擬時間。煊程科技今年參與經濟部推動的 TREE Program，並進入柏克萊加大 SkyDeck 培訓。
World Journal reports on NeuroShine: the team has developed an electronic design automation (EDA) platform that combines AI with multi-physics simulation, integrating different simulation tools to analyze thermal, electrical and structural factors together and shorten chip design and advanced packaging simulation time. This year NeuroShine joined the TREE Program promoted by the Ministry of Economic Affairs and trained at UC Berkeley SkyDeck.