本公司於 InnoVEX 展出 AI 驅動的先進封裝智慧平台 InPack.AI，透過代理 AI（Agentic AI）、多物理整合與高速模擬技術，協助企業提升設計效率、降低開發成本。
Our company exhibited InPack.AI, its AI-driven advanced packaging platform, at InnoVEX, using agentic AI, multi-physics integration and high-speed simulation to help companies improve design efficiency and lower development costs.