煊程科技以「InPack.AI-生成式 AI 驅動的次世代 EDA 工具」獲頒 GenAI Stars 2025 金質獎，應用產業領域為「GenAI 在半導體產業之應用」。InPack.AI 是 AI 驅動、具反向設計的自動化輔助設計工具，支援異質材料封裝設計、物理場驗證與高速處理。
NeuroShine received the GenAI Stars 2025 Gold Quality Award for "InPack.AI: a next-generation EDA tool driven by generative AI", in the application field of GenAI in the semiconductor industry. InPack.AI is an AI-driven automated design tool with inverse design, supporting heterogeneous-material package design, physics-field verification and high-speed processing.