Sparknify 以 #MeetFounders 介紹 Taiwan Venture Day 上的台灣深科技新創煊程科技：NeuroShine 開發「InPack.AI」，一套結合 AI 與先進最佳化技術的 EDA 工具，協助半導體工程師簡化複雜設計流程，突破傳統反覆模擬的限制，更快速、更有效率地完成 IC 設計。
Sparknify's #MeetFounders introduces NeuroShine, a Taiwanese deep-tech startup at Taiwan Venture Day: NeuroShine developed InPack.AI, an EDA tool that combines AI with advanced optimization to help semiconductor engineers simplify complex design flows, move past the limits of traditional repeated simulation, and complete IC designs faster and more efficiently.