本公司於美西時間 2026 年 6 月 9 日在美國矽谷舉辦「AI-Native EDA Research & Technology Sharing」技術交流研討會，吸引北美半導體產業專家、創投與科技創業領袖參加，與會專家肯定 InPack.AI 的技術。
On June 9, 2026 (Pacific Time), our company held the "AI-Native EDA Research & Technology Sharing" seminar in Silicon Valley, attended by North American semiconductor experts, venture capitalists and tech entrepreneurs, where experts praised the technology behind InPack.AI.