New

Intelligent Automation for Electronic design.

Intelligent Automation for Electronic design.

NeuroShin's InPack.AI brings AI to your multi-scale simulation tasks.

NeuroShin's InPack.AI
brings AI to your multi-scale simulation tasks.

InPack.AI EDA

Get in touch

Get in touch

Get in touch

Get in touch

View features

View features

the Next Generation of Semiconductor Design

the Next Generation of Semiconductor Design

”InPack.AI is to transform months of EDA design into days. We don't just build a tool; we create a intelligent workflow that delivers real solutions.”

”InPack.AI is to transform months of EDA design into days. We don't just build a tool; we create a intelligent workflow that delivers real solutions.”

user pic

Prof. Chi-Hua Yu (游濟華) | Co-founder & Head of LAiMM Lab

Prof. Chi-Hua Yu (游濟華) | Co-founder & Head of LAiMM Lab

Prof. Chi-Hua Yu (游濟華) | Co-founder & Head of LAiMM Lab

Our Features

Our Features

InPack.AI Takes
Your IC Design to the Next Level

InPack.AI Takes Your IC Design to the Next Level

We design, develop, and implement InPack.AI:
An EDA tools that help your IC design smarter, not harder.

We design, develop, and implement InPack.AI:
An EDA tools that help your IC design smarter, not harder.

Warpage Analysis

  • Simulation Configuration

    模擬配置

  • Geometry & Material Property

    幾何參數與材料特性

  • Data Generation & Processing

    數據生成與處理

  • AI Model & Performance

    AI 模型與性能驗證

  • DQN Reinforcement Learning

    DQN 強化學習應用

Warpage Analysis

  • Simulation Configuration

    模擬配置

  • Geometry & Material Property

    幾何參數與材料特性

  • Data Generation & Processing

    數據生成與處理

  • AI Model & Performance

    AI 模型與性能驗證

  • DQN Reinforcement Learning

    DQN 強化學習應用

Warpage Analysis

  • Simulation Configuration

    模擬配置

  • Geometry & Material Property

    幾何參數與材料特性

  • Data Generation & Processing

    數據生成與處理

  • AI Model & Performance

    AI 模型與性能驗證

  • DQN Reinforcement Learning

    DQN 強化學習應用

AI-Powered Warpage Simulation

AI-Powered Warpage Simulation

AI-Driven Warpage Analysis

AI-Driven Warpage Analysis

AI-Driven Warpage Analysis

Move beyond tedious traditional workflows. Our platform uses an AI core engine to shorten warpage analysis from months to days, achieving a proven improvement rate. This significantly boosts your design yield and efficiency.

Move beyond tedious traditional workflows. Our platform uses an AI core engine to shorten warpage analysis from months to days, achieving a proven improvement rate. This significantly boosts your design yield and efficiency.

Move beyond tedious traditional workflows. Our platform uses an AI core engine to shorten warpage analysis from months to days, achieving a proven improvement rate. This significantly boosts your design yield and efficiency.

AI-driven

AI-driven

Reinforcement Learning

Reinforcement Learning

600x Acceleration

600x Acceleration

InPack.AI

InPack.AI

Generative AI Core Engine

Generative AI Core Engine

Generative AI Core Engine

InPack.AI doesn't just predict; it creates.
Through a Deep Reinforcement Learning (DQN) framework, it accurately simulates multi-physics effects without a massive database, providing reliable scientific validation for your designs with an R² score of up to 0.983.

NeuroShine AI doesn't just predict; it creates.
Through a Deep Reinforcement Learning (DQN) framework, it accurately simulates multi-physics effects without a massive database, providing reliable scientific validation for your designs with an R² score of up to 0.983.

NeuroShine AI doesn't just predict; it creates.Through a Deep Reinforcement Learning (DQN) framework, it accurately simulates multi-physics effects without a massive database, providing reliable scientific validation for your designs with an R² score of up to 0.983.

Generative AI

Generative AI

DQN

DQN

cGAN

cGAN

BIGRU

Many more

Many more

What can InPack.AI help with?

InPack.AI seamlessly integrates thermal, mechanical, and electrical simulations

|

Analyze

Simulation

Research

What can InPack.AI help with?

InPack.AI seamlessly integrates thermal, mechanical, and electrical simulations

|

Analyze

Simulation

What can InPack.AI help with?

InPack.AI seamlessly integrates thermal, mechanical, and electrical simulations

|

Analyze

Simulation

Research

NeuroShine Member Loading…

LAiMM Lab

NCKU

NeuroShine

NeuroShine Member Loading…

LAiMM Lab

NCKU

NeuroShine

NeuroShine Member Loading…

LAiMM Lab

NCKU

NeuroShine

Academic & Industry Collaboration

Academic & Industry Collaboration

Top Academic and Industry Endorsements

Top Academic and Industry Endorsements

Top Academic and Industry Endorsements

NeuroShine technology is rooted in rigorous academic research lab LAiMM from National Cheng Kung University and has been battle-tested through deep collaborations with industry leaders like ASE. This powerful dual endorsement ensures our technological leadership and high commercial reliability.

NeuroShine technology is rooted in rigorous academic research lab LAiMM from National Cheng Kung University and has been battle-tested through deep collaborations with industry leaders like ASE. This powerful dual endorsement ensures our technological leadership and high commercial reliability.

NeuroShine technology is rooted in rigorous academic research lab LAiMM from National Cheng Kung University and has been battle-tested through deep collaborations with industry leaders like ASE. This powerful dual endorsement ensures our technological leadership and high commercial reliability.

Academic-backed

Academic-backed

Industry Collaboration

Industry Collaboration

Proven Reliability

Proven Reliability

Cloud-Native Service

Cloud-Native Service

Flexible Deployment & Support
Cloud-Native Solutions

Flexible Deployment & Support
Cloud-Native Solutions

Flexible Deployment & Support
Cloud-Native Solutions

InPack.AI cloud-native SaaS solution enables high-performance computing from anywhere, while also offering customized on-premise options to meet enterprise-grade data security needs. Our expert team stands as your powerful technical backup, providing seamless professional support.

InPack.AI cloud-native SaaS solution enables high-performance computing from anywhere, while also offering customized on-premise options to meet enterprise-grade data security needs. Our expert team stands as your powerful technical backup, providing seamless professional support.

InPack.AI cloud-native SaaS solution enables high-performance computing from anywhere, while also offering customized on-premise options to meet enterprise-grade data security needs. Our expert team stands as your powerful technical backup, providing seamless professional support.

SaaS

SaaS

On-Premise Option

On-Premise Option

Secure Infrastructure

Secure Infrastructure

Cloud-Native Solution

Here is your IC-Design Workflow

On Going Project :

InPack.AI EDA Tool

90% Finsihed

MLOps Pipeline

Modeling

Simulation

Prediction

Optimization

Geometry Definition

Material Characterization

Cloud-Native Solution

Here is your IC-Design Workflow

On Going Project :

InPack.AI EDA Tool

90% Finsihed

MLOps Pipeline

Modeling

Simulation

Prediction

Optimization

Geometry Definition

Material Characterization

Cloud-Native Solution

Here is your IC-Design Workflow

On Going Project :

InPack.AI EDA Tool

90% Finsihed

MLOps Pipeline

Modeling

Simulation

Prediction

Optimization

Geometry Definition

Material Characterization

Our Process

Our Process

Our Simple, Smart, and Scalable EDA Process

Our Simple, Smart, and Scalable EDA Process

We design, develop, and implement InPack.AI that help your IC design smarter, not harder.

We design, develop, and implement InPack.AI that help your IC design smarter, not harder.

Step 1

Generative Modeling

Generative Modeling

Using AI-assisted geometry and material characterization, we rapidly build complex 2.5D/3D packaging models. This foundational step ensures the accuracy and reliability of all subsequent analyses.

Using AI-assisted geometry and material characterization, we rapidly build complex 2.5D/3D packaging models. This foundational step ensures the accuracy and reliability of all subsequent analyses.

Analyzing current workflow..

Geometry check

Material check

Boundary check

Speed check

Model Build

Analyzing current workflow..

Geometry check

Material check

Boundary check

Speed check

Model Build

Step 2

Rapid Simulation

Rapid Simulation

Ditch time-consuming traditional methods. Our platform automates multi-physics simulations, achieving 600x computational acceleration, compressing months of waiting into days.

Ditch time-consuming traditional methods. Our platform automates multi-physics simulations, achieving 600x computational acceleration, compressing months of waiting into days.

  • class AutomationTrigger:
    def __init__(self, threshold):
    self.threshold = threshold
    self.status = "inactive"

    def check_trigger(self, value):
    if value > self.threshold:
    self.status = "active"
    return "Automation triggered!"
    else:
    return "No action taken."
    def get_status(self):
    return f"Status: {self.status}"

  • class AutomationTrigger:
    def __init__(self, threshold):
    self.threshold = threshold
    self.status = "inactive"

    def check_trigger(self, value):
    if value > self.threshold:
    self.status = "active"
    return "Automation triggered!"
    else:
    return "No action taken."
    def get_status(self):
    return f"Status: {self.status}"

  • class AutomationTrigger:
    def __init__(self, threshold):
    self.threshold = threshold
    self.status = "inactive"

    def check_trigger(self, value):
    if value > self.threshold:
    self.status = "active"
    return "Automation triggered!"
    else:
    return "No action taken."
    def get_status(self):
    return f"Status: {self.status}"

  • class AutomationTrigger:
    def __init__(self, threshold):
    self.threshold = threshold
    self.status = "inactive"

    def check_trigger(self, value):
    if value > self.threshold:
    self.status = "active"
    return "Automation triggered!"
    else:
    return "No action taken."
    def get_status(self):
    return f"Status: {self.status}"

Step 3

Accurate Prediction

Accurate Prediction

Our InPack.AI core engine performs instant, accurate predictions. In warpage analysis, our model achieves an R² score of 0.983, providing a reliable basis for your decisions.

Our InPack.AI core engine performs instant, accurate predictions. In warpage analysis, our model achieves an R² score of 0.983, providing a reliable basis for your decisions.

Our solution

Your stack

Our solution

Your stack

Step 4

Continuous Optimization

Continuous Optimization

Using reinforcement learning (DQN), our tool actively explores and finds optimal solutions. In practice, we've achieved a warpage improvement rate of 69.89%, fundamentally solving yield issues.

Using reinforcement learning (DQN), our tool actively explores and finds optimal solutions. In practice, we've achieved a warpage improvement rate of 69.89%, fundamentally solving yield issues.

Warpage improvement rate

Speed will increase by 20%

Workflow system

Update available..

Version control

Up to date

Warpage improvement rate

Speed will increase by 20%

Workflow system

Update available..

Version control

Up to date

Benefits

Benefits

The Key Benefits of InPack.AI for Your EDA Simulation

The Key Benefits of InPack.AI for Your EDA Simulation

Discover how InPack.AI enhances efficiency, reduces costs, and drives design simulation with smarter, faster processes.

Discover how InPack.AI enhances efficiency, reduces costs, and drives design simulation with smarter, faster processes.

Increased Productivity

Gain actionable insights with AI-driven analytics to improve decision-making and design strategy.

Increased Productivity

Gain actionable insights with AI-driven analytics to improve decision-making and design strategy.

Increased Productivity

Gain actionable insights with AI-driven analytics to improve decision-making and design strategy.

Multi-Physics Integration

Seamlessly integrates multi-physics analysis on one platform, eliminating tool fragmentation.

Multi-Physics Integration

Seamlessly integrates multi-physics analysis on one platform, eliminating tool fragmentation.

Multi-Physics Integration

Seamlessly integrates multi-physics analysis on one platform, eliminating tool fragmentation.

24/7 Availability

AI-powered systems operate around the clock, ensuring seamless support and execution without downtime.

24/7 Availability

AI-powered systems operate around the clock, ensuring seamless support and execution without downtime.

24/7 Availability

AI-powered systems operate around the clock, ensuring seamless support and execution without downtime.

Cost Reduction

AI automates routing and parameter settings, reducing manual intervention, and optimizing resource allocation.

Cost Reduction

AI automates routing and parameter settings, reducing manual intervention, and optimizing resource allocation.

Cost Reduction

AI automates routing and parameter settings, reducing manual intervention, and optimizing resource allocation.

Data-Driven Insights

Leverage AI to analyze vast data sets, identify trends, and make smarter, faster, and more accurate desgin decisions.

Data-Driven Insights

Leverage AI to analyze vast data sets, identify trends, and make smarter, faster, and more accurate desgin decisions.

Data-Driven Insights

Leverage AI to analyze vast data sets, identify trends, and make smarter, faster, and more accurate desgin decisions.

Predictive Accuracy

InPack.AI core engine performs instant, accurate predictions in warpage analysis, providing a reliable basis for your decisions.

Predictive Accuracy

InPack.AI core engine performs instant, accurate predictions in warpage analysis, providing a reliable basis for your decisions.

Predictive Accuracy

InPack.AI core engine performs instant, accurate predictions in warpage analysis, providing a reliable basis for your decisions.

About us

Who We Are

Who We Are

NeuroShine was founded from our deep insight and vision for Taiwan's semiconductor industry. To fill the domestic gap in the critical EDA software sector, we committed to independent R&D, leveraging generative AI to build a world-class third-generation EDA tool.

NeuroShine was founded from our deep insight and vision for Taiwan's semiconductor industry.

To fill the domestic gap in the critical EDA software sector, we committed to independent R&D, leveraging generative AI to build a world-class third-generation EDA tool.

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Chi-Hua Yu

游濟華

Founder & CTO

An Associate Professor at NCKU specializing in AI bionics and multi-physics simulation technologies.

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Chi-Hua Yu

游濟華

Founder & CTO

An Associate Professor at NCKU specializing in AI bionics and multi-physics simulation technologies.

user pic

Di-Chun Hu

胡迪群

CEO

A founding pioneer of Taiwan's LCD display industry with a Ph.D. from MIT's Department of Materials Science and Engineering.

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Di-Chun Hu

胡迪群

CEO

A founding pioneer of Taiwan's LCD display industry with a Ph.D. from MIT's Department of Materials Science and Engineering.

Shin-Ruei Lin

林欣瑞

Chairman & COO

A senior software development expert from TSMC, specializing in numerical simulation methods and industrial software design.

Shin-Ruei Lin

林欣瑞

Chairman & COO

A senior software development expert from TSMC, specializing in numerical simulation methods and industrial software design.

Yu-Chi Chen

陳昱圻

CISO

A professor from Taipei Tech (NTUT), focusing on cryptography and its application to AI privacy-enhancing technologies.

Yu-Chi Chen

陳昱圻

CISO

A professor from Taipei Tech (NTUT), focusing on cryptography and its application to AI privacy-enhancing technologies.

Jayson Ng

黃奇琛

CIO

An ex-backend engineer from the finance industry, with a Master's degree in Computer Science from Columbia University.

Jayson Ng

黃奇琛

CIO

An ex-backend engineer from the finance industry, with a Master's degree in Computer Science from Columbia University.

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Jia-Lin Liu

劉佳林

CHO & ES to Chairman

Possesses excellent communication, coordination, and organizational skills, focused on strengthening the team's talent competitiveness.

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Jia-Lin Liu

劉佳林

CHO & ES to Chairman

Possesses excellent communication, coordination, and organizational skills, focused on strengthening the team's talent competitiveness.

Ching-Han Chen

陳靖翰

R&D Manager

A cloud and software expert with extensive experience from IBM and SAP headquarters, specializing in system design and maintenance.

Ching-Han Chen

陳靖翰

R&D Manager

A cloud and software expert with extensive experience from IBM and SAP headquarters, specializing in system design and maintenance.

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Hsu-Li Mao

毛栩櫟

R&D Manager

Specializes in materials science and generative AI application development, with rich experience in project planning and execution.

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Hsu-Li Mao

毛栩櫟

R&D Manager

Specializes in materials science and generative AI application development, with rich experience in project planning and execution.

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Fan-Hsuan Ku

辜凡瑄

Sales&Marketing Manager

A seasoned sales professional proficient in building and maintaining long-term customer relationships to ensure client satisfaction.

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Fan-Hsuan Ku

辜凡瑄

Sales&Marketing Manager

A seasoned sales professional proficient in building and maintaining long-term customer relationships to ensure client satisfaction.

FAQ's

Frequently Asked Questions

Find quick answers to the most common support questions

Still Have Questions?

Still have questions? Feel free to get in touch with us today!

Ask A Question

How does InPack.AI EDA handle multi-physics simulation?

Is our design data secure?

Can InPack.AI integrate with our existing EDA workflow?

Besides warpage, what other specific problems can your tool solve?

What kind of support can we expect when using InPack.AI?

FAQ's

Frequently Asked Questions

Find quick answers to the most common support questions

Still Have Questions?

Still have questions? Feel free to get in touch with us today!

Ask A Question

How does InPack.AI EDA handle multi-physics simulation?

Is our design data secure?

Can InPack.AI integrate with our existing EDA workflow?

Besides warpage, what other specific problems can your tool solve?

What kind of support can we expect when using InPack.AI?

FAQ's

Frequently Asked Questions

Find quick answers to the most common support questions

Still Have Questions?

Still have questions? Feel free to get in touch with us today!

Ask A Question

How does InPack.AI EDA handle multi-physics simulation?

Is our design data secure?

Can InPack.AI integrate with our existing EDA workflow?

Besides warpage, what other specific problems can your tool solve?

What kind of support can we expect when using InPack.AI?

Contact Us

Contact Us